China-Huawei/Breakthrough

Related A-shares skyrocket as Huawei unveils chip design breakthrough

  • English
  • Español
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  • ID : 8481194
  • Dateline : May 25, 2026/File
  • Location : China
  • Category : Tech
  • Duration : 1'17
  • Audio Language : Chinese/Nats/Part Mute
  • Source : China Central Television (CCTV)
  • Restrictions : No access Chinese mainland
  • Published : 2026-05-26 14:49
  • Last Modified : 2026-05-26 17:09:22
  • Version : 1
  • ID : 8481194
  • Dateline : 25 may. 2026/Archivo
  • Location : China
  • Category : Tech
  • Duration : 1'17
  • Audio Language : Chino/Nats/Parte Muda
  • Source : China Central Television (CCTV)
  • Restrictions : No acceso a la parte continental de China
  • Published : 2026-05-26 16:25
  • Last Modified : 2026-05-26 17:09:22
  • Version : 1

China-Huawei/Breakthrough

Related A-shares skyrocket as Huawei unveils chip design breakthrough

Dateline : May 25, 2026/File

Location : China

Duration : 1'17

  • English
  • Español


Shanghai, China - May 25, 2026 (CCTV - No access Chinese mainland)
1. Various of 2026 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Circuits and Systems (ISCAS) in progress; He Tingbo, president of Huawei's semiconductor business, speaking on stage

FILE: China - Exact Location and Date Unknown (CCTV - No access Chinese mainland)
2. Various of chip production in progress

Shanghai, China - May 25, 2026 (CCTV- No access Chinese mainland)
3. SOUNDBITE (English) He Tingbo, president, Huawei's semiconductor business (partially overlaid with shot 4/ending with shot 5):
"We saw time scaling can deliver strong benefits across devices, circuits, chips, and systems. The Kirin 2026 [mobile chip is] going to the market later this year. It marks our first-ever successful implementation of logic folding."
++SHOT OVERLAYING SOUNDBITE++
4. Slide on Huawei's Kirin2026 chip practice
++SHOT OVERLAYING SOUNDBITE++
5. He speaking on stage

FILE: China - Exact Location and Date Unknown (CCTV - No access Chinese mainland)
6. Various of chip production in progress

Beijing, China - May 25, 2026 (CCTV - No access Chinese mainland)
7. Various of screen showing stock information

FILE: Shenzhen City, Guangdong Province, south China - Date Unknown (CCTV - No access Chinese mainland)
8. Various of Huawei reception desk, Huawei logo

FILE: Shenzhen City, Guangdong Province, south China - Date Unknown (CGTN - No access Chinese mainland)
9. Various of Huawei headquarters


China's tech giant Huawei on Monday announced the Tau Scaling Law, a breakthrough transcending from the geometric scaling logic that has long underpinned chip development and production cost.

The breakthrough was announced by He Tingbo, a Huawei board member and president of the company's semiconductor business department, at the 2026 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Circuits and Systems (ISCAS) held in Shanghai.

The Tau Scaling Law provides an alternative path for Moore's Law, which improves chip performance by shrinking transistor size and now faces technological bottlenecks, as device dimensions are getting closer to physical limits.

The Tau Scaling Law, however, proposes replacing geometric scaling with time scaling, enabling signals to run faster, shorter, and with less waiting time in the system, according to He.

"We saw time scaling can deliver strong benefits across devices, circuits, chips, and systems. The Kirin 2026 [mobile chip is] going to the market later this year. It marks our first-ever successful implementation of logic folding," said He.

Driven by this news, the A-share chip sector surged on Monday, with the STAR Market 50 Index, which tracks the 50 largest stocks listed on China's sci-tech innovation board (commonly known as the STAR Market), hitting a new all-time high, and many stocks also hit their daily limit.

ID : 8481194

Published : 2026-05-26 14:49

Last Modified : 2026-05-26 17:09:22

Source : China Central Television (CCTV)

Restrictions : No access Chinese mainland

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